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SolverPI-Resin 70SY1

  • Description
Product Detail

    Product Name: Polyimide Resin

    Item No.: SolverPI-Resin 70SY1

     SolverPI-Resin 70SY1 is a high performance copper clad laminate used for the polyimide resin, polyimide alternative Kerimid 701 resin system.

     SolverPI-Resin 70SY1 is based on bismaleimide-based polyimide value system, in other chemical composition does not contain DDM and other components, in line with environmental protection requirements

     Features:

    l  High glass transition temperature and thermal stability;

    l  Excellent solvent resistance;

    l  Low coefficient of thermal expansion (CTE, T-axis);

    l  High copper peel strength;

    l  Good storage stability.

     Quality Index

    l  Appearance: reddish brown liquid;

    l  Solid content: 50-70%;

    l  Gel time (171 ?): 200-600 seconds

     CCL performance indicators

    l  The glass transition temperature (Tg): =200 ?;

    l  Flame retardancy (UL-94): VO;

    l  Copper foil peeling strength (ibs / in): =7

     

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